JPH071833Y2 - プラスチック筐体 - Google Patents
プラスチック筐体Info
- Publication number
- JPH071833Y2 JPH071833Y2 JP1989078748U JP7874889U JPH071833Y2 JP H071833 Y2 JPH071833 Y2 JP H071833Y2 JP 1989078748 U JP1989078748 U JP 1989078748U JP 7874889 U JP7874889 U JP 7874889U JP H071833 Y2 JPH071833 Y2 JP H071833Y2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- case
- abs resin
- resin
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920003023 plastic Polymers 0.000 title claims description 12
- 239000004033 plastic Substances 0.000 title claims description 12
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 10
- 238000005530 etching Methods 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- JZULKTSSLJNBQJ-UHFFFAOYSA-N chromium;sulfuric acid Chemical compound [Cr].OS(O)(=O)=O JZULKTSSLJNBQJ-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989078748U JPH071833Y2 (ja) | 1989-07-05 | 1989-07-05 | プラスチック筐体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989078748U JPH071833Y2 (ja) | 1989-07-05 | 1989-07-05 | プラスチック筐体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0320492U JPH0320492U (en]) | 1991-02-28 |
| JPH071833Y2 true JPH071833Y2 (ja) | 1995-01-18 |
Family
ID=31622293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989078748U Expired - Fee Related JPH071833Y2 (ja) | 1989-07-05 | 1989-07-05 | プラスチック筐体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH071833Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5105361B2 (ja) * | 2008-01-11 | 2012-12-26 | レノボ・シンガポール・プライベート・リミテッド | 電子機器 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61127197A (ja) * | 1984-11-24 | 1986-06-14 | 凸版印刷株式会社 | 電磁波シ−ルド性を有するプラスチツクハウジング |
-
1989
- 1989-07-05 JP JP1989078748U patent/JPH071833Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0320492U (en]) | 1991-02-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2825670B2 (ja) | 高周波回路装置のシールド構造 | |
| US6178318B1 (en) | Shielding housing and a method of producing a shielding housing | |
| JPH0745982A (ja) | シールドケースとプリント配線板との接続構造 | |
| KR19990037087A (ko) | 고밀도 가요성 회로 요소 및 이를 사용한 통신장치 | |
| AU2002211084A1 (en) | Methods of manufacturing a printed circuit board shielded against interfering radiation | |
| WO1994027421A1 (en) | Electrical interconnect apparatus | |
| US4455448A (en) | Housing for microwave electronic devices | |
| JPH0766506A (ja) | 電子機器 | |
| JPS5883441A (ja) | 携帯用移動無線装置の構造 | |
| US5652410A (en) | Conductive insert for providing electromagnetic charge protection | |
| WO1998054942A1 (en) | A shielding housing, methods of producing a shielding housing and use thereof | |
| JPH071833Y2 (ja) | プラスチック筐体 | |
| JPH08316662A (ja) | 電子装置 | |
| JP3283161B2 (ja) | シールドケース及び電子機器 | |
| JP2000307285A (ja) | 回路基板用中間枠 | |
| JP2514979B2 (ja) | 電子機器のシ−ルド構造 | |
| JP2766265B2 (ja) | 電子機器の筐体 | |
| US20040109284A1 (en) | Panel antenna and method for installing the same | |
| WO1999043191A1 (en) | Housing with shielding properties and method for making it | |
| JPH11354966A (ja) | シールド構造体 | |
| JP2892139B2 (ja) | 電子機器の筐体 | |
| CN221598429U (zh) | 异形电路板定位架及电子设备 | |
| JP2626627B2 (ja) | 携帯電話機の筐体 | |
| JP3570891B2 (ja) | 送受信ユニット | |
| JP3174253B2 (ja) | ラバーコンタクトスイッチ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |